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  • 分类:设备展示
  • 发布时间:2019-05-27 00:00:00
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No.

Item

Capability

1

No.of Layer层数

2—22Layers

2

Finished Board Size(Max)完成板尺寸(最大)

23″×32″(584mm×813mm)

3

Finished Board Size(Min)完成板尺寸(最小)

3.0″×2.0″ (76mm×51mm)

4

Board Thickness(Max)板厚度(最大)

0.126″(3.2mm)

5

Board Thickness(Min)板厚度(最小)

0.016 ″(0.4mm)

6

T/C Thickness(Min)芯板厚度(最小)

0.0039″(0.1mm)

7

Finished Board Thickness Tolerance成品厚度公差
(Board Thickness≥0.8mm) (板厚≥0.8mm)

±10%

8

Finished Board Thickness Tolerance成品厚度公差
(0.4mm≤Board Thickness<0.8mm) (0.4mm≤板厚<0.8mm)

±3mil(±0.075mm)

9

Warpage(Max)板曲(最大)

≤0.7%

10

Drilling Hole Diameter(Max)钻孔孔径(最大)

Φ0.252″(6.4mm)

11

Drilling Hole Diameter(Min)钻孔孔径(最小)

Φ0.0079″(0.20mm)

12

Finished Hole Diameter(Min)完成孔孔径(最小)

Φ0.004 ″(0.10mm)

13

Base Copper Thickness of Outer Layer(Min)
外层底铜厚度(最小)

1/3 OZ (0.012mm)

14

Base Copper Thickness of Outer Layer(Max)
外层底铜厚度(最大)

5 OZ (0.175mm)

15

Base Copper Thickness of Inner Layer(Min)
内层底铜厚度(最小)

1/2 OZ (0.017mm)

16

Base Copper Thickness of Inner Layer(Max)
内层底铜厚度(最大)

5 oz (0.175mm)

17

Dielectric Thickness of Inner Layer(Min)
绝缘层厚度(最小)

0.0030″ (0.076mm)

18

Type of Base Material板料类型

CEM-3;FR-4 (130Tg℃);
FR-4 (140Tg℃);

FR-4 (170Tg℃)

19

Aspect Ratio of Plated Hole(Max)
孔电镀纵横比(最大)

8:1

20

Hole Diameter Tolerance(PTH)孔径公差(镀通孔)

±3mil(±0.076mm)

21

Hole Diameter Tolerance(NPTH)孔径公差(非镀通孔)

±2mil(±0.051mm)

22

Hole Position Tolerance(Compared with CAD data)
孔位公差(与CAD数相比)

±3mil(±0.076mm)

23

Copper Thickness of PTH Wall(SMOBC)孔壁铜厚

≥0.8mil(≥0.020mm)

24

Design Line Width/Space of Outer Layer(Min)
外层设计线宽/间距(最小)

T/TOZ 3.5mil/3.5mil

(0.089mm/0.089mm)
H/HOZ 3.5mil/3.5mil

(0.089mm/0.089mm)
1/1OZ 4mil/4mil

(0.102mm/0.102mm)
2/2OZ 5mil/5mil

(0.127mm/0.127mm)
3/3OZ 6mil/6mil

(0.152mm/0.152mm)

25

Design Line Width/Space of Inner Layer(Min)
内层设计线宽/间距(最小)

H/HOZ 3mil/3mil

(0.076mm/0.076mm)
1/1OZ 4mil/4mil

(0.102mm/0.102mm)
2/2OZ 5mil/5mil

(0.127mm/0.127mm)
3/3OZ 6mil/6mil

(0.152mm/0.152mm)
5/5OZ 9mil/9mil

(0.229mm/0.229mm)

26

Tolerance After Etching
蚀刻公差

±20%(Base Copper H/H oz)
±20%(Base Copper 1/1 oz)

27

Impedance Tolerance of Inner/Outer Layer
内外层阻抗公差

±10%(Base Copper >50Ω)
±5Ω(Base Copper ≤50Ω)

28

Pattern to Pattern Tolerance(Min)
图形对图形精度(最小)

±5mil(±0.127mm)

29

Pattern to Hole Tolerance(Min)
外层图形对孔位精度(最小)

±4mil(±0.102mm)

30

Pattern to Outline(Outer Layers)(Min)
外层图形对板边精度(最小)

±6mil(±0.152mm)

31

Pattern to Outline(Inner Layers)(Min)
内层图形对板边精度(最小)

±10mil(±0.254mm)

32

Hole to Hole Tolerance(Min)
孔位对孔位精度(最小)

±2mil(±0.05mm)

33

The Minimum Spacing(Hole to Hole)
孔与孔间最小距离(保证不破孔)

12mil

34

Hole to Outline Tolerance(Min)
孔位对板边精度(最小)

Φd<1.0mm

±8mil(±0.204mm)
±6mil(±0.152mm)

Φd≥1.0mm

35

Solder Mask Registration阻焊对位精度公差

±2mil

36

Solder Mask Thickness(Min)阻焊厚度

≥10μm

37

Solder Dam (Min)阻焊桥宽(最小)

3mil(0.076mm)

38

Diameter of Solder Mask Plugging Hole 阻焊塞孔孔径

>0.75mm(Solder In Hole)
0.55-0.75mm(Solder Ball On Single Side)
<0.55mm(No Solder Ball)

39

Legend Line Width 字符线宽

4mil

40

Legend height and width (on the circuit)
字符高度和宽度(位于线路上时)

height:25mil(0.635mm)
Width:15mil(0.381mm)

41

Legend height and width (on the big area of copper or lamination)字符高度和宽度(位于大铜面或大基材区上时)

height:22mil(0.559mm)
Width:13mil(0.330mm)

42

Legend Registration字符对位精度公差

4mil(0.102mm)

43

Legend Line Width (Min)of Solder Mask Opening
绿油开窗文字宽度(最小)

5mil(0.127mm)

44

Nickel Thickness for Immersion Gold

(Measured at the Minimum Point)
沉镍/金之镍厚(最薄点)

102-200 uin (2.54-5 μm)

45

Gold Thickness for Immersion Gold

(Measured at the Minimum Point)
沉镍/金之金厚(最薄点)

1-4 uin(0.0254-0.102 μm)

46

Silver Thickness for Immersion Silver

(Measured at the Minimum Point)
沉银之银厚(最薄点)

6-12 uin(0.15-0.3 μm)

47

Tin Thickness for HASL 锡厚(热风整平)

20-1600 uin(0.5-40 μm)

48

Tin Thickness for Immersion Tin

(Measured at the Minimum Point)
沉锡之锡厚(最薄点)

31.5-48 uin(0.8-1.2 μm)

49

Thickness for OSP

(Measured at the Minimum Point)
抗氧化膜厚(最薄点)

8-12 uin (0.2-0.3 μm)

50

Carbon Ink Resistance碳油方阻

20Ω/square

51

Carbon conductor Spacing(Min)

碳油间距(最小)

15mil(0.381mm)

52

Punching Tolerance (Edge to Edge)

(Min)(For Laminate CEM-3 Series)
冲外形公差(边到边)(最小)(CEM-X系列)

±6mil(±0.152mm)

53

Punching Tolerance (Hole to Edge )

(Min)(For Laminate CEM-3 Series)
冲外形公差(孔到边)(最小)(CEM-X系列)

±5mil(±0.127mm)

54

Punching Tolerance (Edge to Edge )

(Min)(For Laminate FR-4 Series)
冲外形公差(边到边)(最小)(FR-X系列)

±8mil(±0.203mm)

55

Punching Tolerance (Hole to Edge )

(Min)(For Laminate FR-4 Series)
冲外形公差(孔到边)(最小)(FR-X系列)

±7mil(±0.178mm)

56

Routing Tolerance (Edge to Edge )(Min)
铣外形公差(边到边)(最小)

±4mil(±0.102mm)

57

Routing Tolerance (Hole to Edge )(Min)
铣外形公差(孔到边)(最小)

±4mil(±0.101mm)

58

Radius By Routing (Internal Angle)(Min)
铣外形圆弧(内角)(最小)

≥16mil (0.4mm)

59

Countersink Hole Size

(When Top Angle is 165°)(Max)
铣沉头孔孔径(当顶角角度为165°)(最大)

0.25″(6.35mm)

60

Slot Width (Min)长槽宽度(最小)

20mil (0.5mm)

61

Slot Tolerance (PTH)

(Length≥2×Width+0.15mm)
长槽形状公差(沉铜)

(当长度≥2×宽度+0.15mm)

±4mil(±0.10mm)

62

Slot Tolerance (PTH)

(Length<2×Width+0.15mm)
长槽形状公差(沉铜)

(当长度<2×宽度+0.15mm)

±5mil(±0.127mm)

63

Slot Tolerance (NPTH)

长槽形状公差(非沉铜)

±3mil(±0.076mm)

64

Test PAD width(Min)

测试焊盘宽度(最小)

Flying Probe test(飞针测试):6mil(0.076mm)
Dedicated test(夹具测试):8mil(0.203mm)

65

Line Width for AOI (Min)

AOI检测线宽(最小)

50μm(2mil)

66

Panel Size for AOI(max)

AOI板面最大检测尺寸

620mm×650mm

67

V-Cut Remaining Thickness Tolerance (Min)
V-槽残厚公差(最小)

±4mil(±0.102mm)

68

V-Cut Angle Tolerance(30°~60°)(Min)
V-槽角度公差(30°~60°)(最小)

±5°

69

V-Cut Misregistration (Min)
V-槽错位度(最小)

±5mil(±0.127mm)

70

Board Thickness for V-Cut (Min)
V-槽板厚(最小)

24mil(0.6mm)

71

V-Cut to Hole Tolerance(Min)
V-槽对孔公差(最小)

±6mil(±0.150mm)

72

V-Cut to V-Cut Tolerance (Min)
V-槽对V-槽位置公差(最小)

±5mil(±0.127mm)

73

Distance from the V-Cut Line to Board Edge (Max)
V-CUT到板边的尺寸(最大)

18 inch

74

HDI hole Diameter(min):5mil
HDI板制作,最小孔径:5mil

4L/6L/8L
1阶4层/1阶6层/1阶8层板

75

Rigid-Flex PCB
软硬结合印制板

2L/4L/6L/8L
2至8层板

76

主要板料供应商如下(The supplier of main malterial):
ITEQ(联茂):SHENGYI(生益):NAN YA(南亚):KINGBORD(建滔)

 

 

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